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System-in-Package Substrate (SiP)

System-in-package (SIP) is a system platform that assembles multiple heterogeneous wafers, sensor components, passive components, etc. in one package.
Its applications include multi-chip modules (MCM), multi-chip packages (MCP), stacked chip packages, packages in packages (PiP), and embedded component carriers.
SIP provides IC system designers with another computing function integration solution besides system-on-chip (SoC).
It has the advantages of integrating heterogeneous chips from different sources, smaller size, thinner thickness, and rapid market entry.

SiP can be a multi-chip module (MCM) planar 2D package, or it can reuse 3D packaging structure to effectively reduce the packaging area.

Its internal bonding technology can be pure wire bonding (Wire Bonding) or FlipChip,
But the two can also be mixed. In addition to 2D and 3D packaging structures, another way to integrate components with a multi-functional substrate can also be included in the scope of SiP.
This technology mainly embeds different components in a multi-functional substrate, which can also be regarded as the concept of SIP to achieve the purpose of functional integration.
Different chip arrangements and different internal bonding technologies enable SIP package types to produce a variety of combinations. zbPCB can customize or flexibly produce according to customer or product needs.

Plastic Ball Gate Array Package Substrate (PBGA)

This is the most basic ball gate array substrate used in wire bonding and packaging. Its basic material is a copper foil substrate impregnated with glass fiber. The plastic ball gate array packaging substrate can be applied to chip packaging with a relatively high pin count. When the chip function is upgraded, the traditional lead frame package structure becomes inadequate with the increase in the number of output/input pins, and the plastic ball gate array package substrate provides a cost-effective solution.

Flip Chip Chip Scale Package Substrate (FCCSP)

The semiconductor chip is not connected to the substrate by wire bonding but is interconnected with the substrate by bumps in a flip-chip state, so it is called FCCSP (Flip Chip Chip Scale Package). Flip-chip wafer-level size packaging will further show the cost advantage. In the recent past, the process cost of bumps on wafers has also continued to drop, which has also led to a faster reduction in packaging costs. Flip-chip chip-level size packaging has become a high-pin-count IC.

Flip Chip Ball Gate Array Package Substrate (FCBGA)

FC-BGA (Flip Chip-Ball Grid Array) substrate is a high-density semiconductor package substrate that can realize the high-speed and multi-functionalization of LSI chips. The flip-chip ball gate array package has very excellent performance and cost advantages in the package of very high output/input pin counts, such as a chip such as microprocessor or an image processor.

If you need IC substrate, please don’t hesitate to contact zbPCB, email: zbwbpcb@188.com