ZHIBO_YNC-Laboratory new material, NC_1

Can replace Bergquist T-CLAD heat dissipation aluminum substrate, Rogers curamik ® heat dissipation ceramic substrate, Kyocera heat dissipation ceramic substrate series products on the market

1. YNC laboratory’s new copper-clad laminate heat dissipation composite material, a new material made of epoxy resin + ALN & AL0O3 + C64 carbon powder under special temperature and pressure, its heat dissipation performance far exceeds all products on the market,

2. Thermal conductivity 3.0W/m²K, TG170℃, while having the advantages of ceramic fiber, aluminum base, carbon fiber and other products, and reducing their defects to a minimum

3. Withstands high temperatures above 1000 degrees, low temperatures below minus 300 degrees, and high voltages above 10,000V

Can replace Bergquist T-CLAD heat dissipation aluminum substrate, Rogers curamik ® heat dissipation ceramic substrate, Kyocera heat dissipation ceramic substrate series products.

4. It can be widely used in supercomputer cooling modules, unmanned driving technology power supply cooling modules, space elevators, satellites, aircraft and all cooling series products that require super computing power

5. This product will be launched together with the new nanofiber; our company already has the mass production capacity of this cooling material, and the new nanofiber can be widely used in medical, aviation technology, AI and war fields;

6. If this type of material is needed in various scientific laboratories, research institutes or war laboratories, you can contact me through VX/VK/WHATSAPP:+8613423860616

Or, email: zbwbpcb@188.com for the latest information and dynamics

7. If you need other materials, such as nanofibers, ceramic fibers, metal-based & carbon mixed composite fibers, carbon-hydrogen fibers, epoxy hydrogen resins and other new materials, you can contact me