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isola 370hr backplane pcb

isola 370hr backplane pcb

Product name: communication backplane pcb

Material: isola 370hr

Df ldissipation factor): 0.021Dk (dielectric constant): 4.04

Glass transition temperature:TG180’CTd 340-C

Number of Layers: 14 layers

Board thickness: 2.4mm

Surface technology lmmersion gold

Copper thickness: 10z

Minimum line width/line spacing: 6mil6mil

The communication backplane PCB is made of Isola 370HR material. The communication backplane bus is a high-speed data path between the PLC host and the expansion module.
It supports I/O data refresh between the host and the expansion module.
The technical level of the backplane bus determines the I/O expansion capability of the PLC product and is the core technology of PLC design and manufacturing.

At present, the PLC PCB board is mostly made of Isola 370HR material. PLC mostly uses serial communication technology to realize the backplane bus.
Compared with the parallel bus, the serial bus has the advantages of fewer transmission lines, low hardware cost, and less susceptible to interference.
The serial bus can improve the reliability of automation equipment in harsh factory and industrial environments.

In the field of communication, PCB is widely used in wireless network transmission, data communication, field network bus, etc.
Subsequent products include backplanes, high-density multilayer boards, high-frequency microwave boards, multi-functional metal substrates, etc.

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The communication PCB board market accounts for about 85% of the global market. The customer certification cycle is 2-3 years.
The threshold for entering high-end customers is high, and the supply chain system is perfect. At present, Zhongbang Company has obtained certification from multiple large-scale high-end customers.
The supply volume of main and automotive electronics and other customers accounts for more than 50% of the company’s annual supply volume.
The company’s supply volume to several major core customers accounts for 10-20%.
We believe that Zhongbang Company is expected to further increase this proportion to 25-35% by expanding production capacity.

Zhongbang Company’s fundraising and investment projects will gradually release production capacity. At present.
The company’s current production capacity is 16 million kilowatts, and the capacity utilization rate has been maintained at a high level.
It is expected that the annual capacity utilization rate this year will be above 90%, and it can basically produce at full capacity.
The company’s fundraising and investment project 75,000 square meters of high-definition PCB expansion project is currently in the planning and infrastructure construction stage .
It is expected to complete construction in March this year, realize production in January next year, and start releasing capacity in March next year.
The 173003G communication high-end system PCB technical transformation project raised in this round mainly includes the construction, expansion and equipment purchase of existing production lines.
At present, part of the production capacity has been released, and the production capacity is expected to be released in the second half of next year.

Zhongbang PCB’s production scale, good development ideas, and excellent management level are also the main factors to ensure the stable growth of Zhongbang PCB.
In the future, although ZTE Corporation is currently in a leading position in the industry, it has not yet achieved absolute leadership in PCB technology.
Through capacity expansion, it is expected to gradually become a leading enterprise in the field of communication backplane PCB.
This fundraising project has laid a good foundation for future capacity expansion.

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