Rogers 5880 PCB

The RT 5880 PCB is a high frequency PCB mainly used for point to point digital readout antennas, micro wire and wire arc microwave applications, microwave guidance systems, microwave radar systems and high frequency circuit boards for commercial aviation telephones.

Rogers 5880 copper foil is typically manufactured by bonding the Teon component of the laminate directly to the electrode surface, where the spherical bonding surface of the Enfoil will mechanically interlock with the Teflon.

Rogers 5880 Datasheet Rogers RT Duroid 5880 Thickness is the dielectric thickness of the material without copper, which makes it easier to calculate the impedance of high frequency PCBs. The thickness of Rt5880 material is: 0.127mm, 0.254mm, 0.381mm, 0.508mm, 0.787mm. 1.575mm and 3.175mm

The copper thickness of RT580 substrate is 0.5oz 18um, 10z (35um, 20z (70um). LPC usually consists of 0.5oz (18um) substrate and Rogers 5880 substrate 18um. The finished copper

Rogers 5880 PcB thickness is about 1oz

Features of Rogers 5880

1. Lowest chance of electrical loss for any PTFE reinforcement

2. Low moisture absorption

3. Isotropic Rogers 5880 substrate

4. Uniform electrical properties at high frequencies

5. Excellent chemical resistance, including printing and coating solvents and reagents

6. Environmentally friendly

Rogers 5880 high frequency laminates use a PTFE composite to reinforce glass fibers.
These microfibers are statistically oriented to maximize optical benefits, providing the most valuable guidance to manufacturers and end users.
These high frequency laminates have the lowest dielectric constant of all products,
And the low dielectric constant makes them suitable for high frequency/broadband applications where dispersion and losses must be minimized. Due to its extremely low water absorption,
T Duroid 5880 is ideal for use in high humidity environments.
These advanced high frequency PCB materials can be easily cut and processed into any solvent and reagent commonly used for PCB boards and plating edges and holes.
They have low conductivity and can be used in any reinforced PTFE material, have extremely low moisture absorption, and are isotropic.
They have uniform electrical properties over frequency. Rogers 5880 is designed for the rigorous applications of integrated circuits and microcircuits. RogerPCB materials have

The lowest DK values of high frequency PCB materials available on the market.
RT Duroid 5880 supports broadband applications at mm microwave frequencies due to its low dielectric constant of 1.96 at 10 GHz

With minimal dispersion and air gap losses. It is a single layer,
Lightweight PfE Teon composite with very low density (1.37 gkm3 and low) to provide high frequency manufacturing (PTH) holes and achieve higher loading.

In addition, the dielectric constant from board to panel is the thermal expansion factor in the Z axis (0lE), which results in a TcDk as low as +22onm/C

Regarding the stability of RT Durold 5880 PCBs, Deo0le pays little attention to the existing control of soldering prices, but sometimes even problems can occur during the soldering process, especially when rough manual soldering tools are used during assembly and rework. We designed an experiment to examine the effect of temperature on the bond strength between copper foil and RT/Duroid 5880. The test sample was a 0.062-inch (1.59 mm thick) piece of RT/Duroid 5880 laminate covered with 1 oz T2 (34 mm thick copper foil). In the experiment, the sample was exposed to a range of different temperatures (from 182 degrees Celsius to 371 degrees Celsius). The sample consisted of a 1/8-inch (3 mm) wide copper wire terminated with a 1/4-inch liner on one side. The copper wire and pads were etched on a 2-inch thick laminate sample.

The experimental measurement consists of three parts

1. Cold peel strength The force required to peel a 1/8 inch (3.2 mm) wide copper wire from the substrate at a 90 degree angle at an ambient temperature of 21 degrees Celsius was measured

After placing the RT/Duroid 580 sample on the solder for 30 seconds.

2. Hot peel strength After immersing the RT/Duroid 5880 sample in solder and stabilizing for one minute, measure the force required to peel a 1/8-inch wide copper wire from the substrate at a 90-degree angle

3. Shear strength After peeling a 1/8-inch wide copper wire from the substrate, leaving only the liner at the end After immersing the RT/Durid580 sample in solder and stabilizing for one minute,

Pull the 1/8-inch wide copper wire and measure the pulling force required to peel the liner Cold strength shows that when the temperature is close to the melting point of Tefon pcBl, 327 degrees Celsius,
The solder joint between Tefon and Cu foil is easily damaged. At this temperature, Tefon is easily oxidized when in contact with Cu foil,
And when Tefon undergoes a phase change, the isolation effect provided by the bonding of TFE to the metal foil surface will gradually be lost.

Hot strength and shear stress show that the solder joint between Tefon and Cu foil is easily damaged at high temperatures,
So care should be taken to avoid excessive temperatures or excessive stress during manual soldering.

Rogers 5880 PCB

RT / Duroid 5880 PCB materials are manufactured with the same high-quality, reliable materials and processes that have earned Rogers major awards as a high-frequency materials manufacturer. In some designs, the dielectric performance of a PCB is theoretical. Whether it’s a high-speed PCB, RFP PCB, or microwave PCB, you’ll find that your PCB prototypes require more PCB dielectric performance than standard FR-4 can provide. We know. That’s why we use Rogers 580 dielectric materials. These new low-loss dielectric materials mean higher performance for demanding PCB prototypes.

Rogers 5880 PcB is high frequency PCB, ZBPcB provides technical support for Rogers duroid 5888 and cheap Rogers rt duroid 5880 price

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