Description

Low Temperature Co-fred Ceramic PCB(LTCC PCB)

Shape: max. 100 mm x 100 mm

Line width /spacing: min.0.075mm/0.15mm
Printed conductor thickness: 10 ~ 25 μ
MPrinting line width accuracy: ± 10 μ
MStack alignment accuracy: ≤ 30 μ M
Through hole diameter: min.0.1mm
Sintering shrinkage accuracy:± 0.2%
6Distance between conductor and shape edge: min.0.2mm
Distance between metal through hole and line: min.0.15mm
Overlap distance of resistance/ Conductor: min.0.15mm
Resistance size: min.0.15mm x 0.15mm
Total number of media layers: s 40 layers

That is, ceramic substrate technology is a three-dimensional integration technology that uses new ceramic materials
And microwave thick film integration technology to achieve complex microwave and digital circuits. With the rapid development of monolithic integration technology,
The integration of active devices is getting higher and higher, reaching an unprecedented level, and the integration of passive devices is particularly important.
LTCC technology can meet the integration requirements of passive devices such as resistors, capacitors, inductors, filters, and couplers.

The resistance values of LTCC substrates are 108, 1002, 1K2, and 10K2, respectively. The surface resistance adjustment method has an accuracy of less than 19%,
and the embedded resistance accuracy is less than 3096. Other passive devices can be designed according to relevant material parameters. TCC substrates can be copper-clad in multiple layers, up to 40 layers.

1. In recent years, ceramic substrate technology has developed rapidly, especially on the basis of traditional ceramic substrates,
High-temperature sintered ceramic substrates and low-temperature CO sintered ceramic substrates have been developed,
Making ceramic substrates more deeply and widely used in high-density assembly of high-power integrated circuits.
Low-temperature sintered multilayer substrates are a newly developed micro-assembly substrate that combines the advantages of thick film technology and high-temperature sintering.
Over the past decade, this type of substrate has developed rapidly. As a high-density and high-speed circuit board, it is widely used in computers, communications, missiles, rocket radars and other fields.

2. Dupon Company of the United States uses 8 layers of low-temperature common-mode integrated circuit substrates in Intel microcontroller test circuits,
And uses 6 layers of low-temperature common-mode ceramic substrates to make multi-chip modules for V200 series supercomputers;
NE Company of the United States has made 78 layers of low-temperature common-mode integrated circuit substrates with an area of 25*225 square millimeters, containing 1154 pins,
And can install up to 100 WLSl chips.

3. The conductive tape ceramic substrate is made of a multilayer ceramic base.
The ceramic substrate is composed of a layer of ceramic material, and a conductive tape is formed on the ceramic layer.
The through holes of the ceramic layer are filled with conductive materials to connect the conductive tape lines of different ceramic layers to form a three-dimensional circuit.
The chip is mounted on the top surface of the multilayer ceramic substrate.
The integrated block is welded together with the leads of the multilayer ceramic substrate through the through holes to form an interconnected circuit.
The metal conductive layer on the surface of the substrate is pre-formed on the inner part of the ceramic substrate and has a pin-shaped terminal.
Multilayer ceramic substrates are used to assemble micro components to form a high-density, high-speed, and high-reliability three-dimensional structure.

Compared with other PCB technologies, LTCC PCB has many advantages

1. Ceramic materials have excellent characteristics such as high frequency, high-speed transmission, and bandwidth. The dielectric constant of TC materials can vary in a wide range depending on the composition. Using highly conductive metal materials as conductor materials can improve the quality factor of the circuit system and increase the flexibility of circuit design;

2. It can adapt to the requirements of high current and high temperature resistance, and has better thermal conductivity than ordinary PCB circuit boards, which greatly optimizes the heat dissipation design of electronic equipment, has high reliability, can be used in harsh environments, and prolongs service life;

3. Multiple layers of circuit boards can be made, and multiple passive components can be embedded, avoiding the cost of packaging components. The above three substrates can be integrated, integrated, and integrated, thereby increasing assembly density or reducing weight,

4. It has good compatibility with other multi-layer board technologies. For example, the combination of LTCC and thin film board technology can achieve higher assembly density and better performance of hybrid multi-layer substrates and hybrid multi-chip modules,

5. The introduction of discontinuous on-resistance can improve the assembly density and assembly quality of each substrate, shorten the production cycle, and reduce costs.

6. Energy saving, material saving and green environmental protection have become the unstoppable trend of the development of the component industry. LTCC also complies with this development demand and minimizes the pollution of raw materials, waste and production process to the environment.

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