Rogers RT/duroid® 6010.2LM is a high-performance PCB substrate material designed for high-frequency and microwave circuits. Renowned for its ultra-high dielectric constant (Dk) and exceptionally low dissipation factor (Df), it is widely used in RF systems, radar, satellite communications, aerospace, and advanced telecommunications. This guide explores its material properties, structural specifications, manufacturing processes, and applications.
1. Composition & Structure
RT/duroid 6010.2LM is a ceramic-filled PTFE (polytetrafluoroethylene) composite. Its structure combines high-purity ceramic particles uniformly dispersed in a PTFE matrix, laminated with electro-deposited copper foil. This design ensures superior high-frequency performance and mechanical stability.
2. Critical Electrical & Mechanical Properties
| Parameter | Typical Value (@10 GHz) | Significance |
|---|---|---|
| Dielectric Constant (Dk) | 10.2 ± 0.25 | Enables compact circuit designs |
| Dissipation Factor (Df) | 0.0023 | Minimizes signal loss in high-frequency applications |
| Volume Resistivity | 5×10⁵ MΩ·cm | Excellent insulation properties |
| Surface Resistivity | 5×10⁶ MΩ | |
| Water Absorption | 0.01% | Ideal for humid environments |
| Thermal Conductivity | 0.86 W/m·K | Efficient heat dissipation |
| Z-Axis CTE | 47 ppm/°C | Reduces via cracking in multilayer designs |
| Decomposition Temperature | 500°C | High thermal stability |
| Flammability Rating | UL94 V-0 | Complies with safety standards |
| Peel Strength (Copper) | 12.3 lbs/in (2.1 N/mm) | Strong copper adhesion |
| Density | 3.1 g/cm³ |
3. Standard PCB Specifications
Layers: 1L, 2L (custom multilayer available)
Copper Weight: 0.5 oz (17 μm), 1 oz (35 μm), 2 oz (70 μm)
Dielectric Thickness: 10 mil (0.254 mm), 25 mil (0.635 mm), 50 mil (1.27 mm), 75 mil (1.90 mm)
Panel Size: Up to 400 mm × 500 mm
Surface Finishes: ENIG, HASL, Immersion Silver, OSP
Solder Mask Colors: Green, Black, Blue, Yellow, Red
1. Typical PCB Structure Example (2-Layer Board)
Construction: Two copper layers with 0.635 mm (25 mil) RT6010.2LM dielectric core.
Finished Thickness: 0.7 mm
Copper Thickness: 1 oz (35 μm)
Surface Finish: ENIG (Electroless Nickel Immersion Gold)
Minimum Trace/Space: 6/6 mil (some manufacturers support 4/4 mil)
Minimum Drill Size: 0.35 mm
Special Features: Edge plating, castellated holes, 100% electrical testing (IPC Class 2).
2. Critical Processing Considerations
Surface Preparation: Avoid mechanical abrasion to prevent increased surface roughness and signal loss.
Drilling: Use carbide drills with low RPM and feed rates. Stack height ≤6.1 mm to prevent material deformation.
Plating: Chemical desmear required for PTFE via walls. ENIG recommended, though minor discoloration may occur.
Panelization: Laser cutting or routing preferred over V-scoring to avoid microcracks.
Handling: Store flat to prevent warping; avoid bending during transport.
3. Visual Reference (Hypothetical Images)
Figure 1: Cross-section of a 2-layer RT6010.2LM PCB showing copper layers and ceramic-PTFE dielectric.
Figure 2: Finished PCB with blue solder mask, gold pads, and castellated edges.
1. Performance Benefits
High Dk (10.2): Reduces circuit size for compact antennas, filters, and couplers.
Ultra-Low Loss (Df=0.0023): Ensures signal integrity up to millimeter-wave frequencies.
Environmental Resilience: Low moisture absorption (<0.01%) suits harsh outdoor/airborne applications.
Thermal Stability: Withstands thermal cycling in multilayer designs.
Manufacturing Consistency: Tight Dk tolerance (±0.25) ensures batch-to-batch reliability.
2. Industry Applications
Satellite communication systems
Radar and defense electronics
5G base station RF frontends
Aerospace navigation/guidance systems
High-power microwave amplifiers
Precision test & measurement equipment
Select dielectric thickness based on operating frequency and impedance requirements.
opt for thicker copper (2 oz) for high-power designs.
Specify edge plating or half-holes for modular assembly.
Collaborate with certified PCB fabricators for DFM (Design for Manufacturing) optimization.
Rogers RT/duroid 6010.2LM PCB material delivers unmatched performance in high-frequency applications, combining precision, durability, and manufacturing flexibility. Its exceptional electrical properties make it indispensable for cutting-edge RF systems, 5G infrastructure, and aerospace technology.
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