ZBPCB has 15 years of PCB manufacturing experience, providing customers with high-quality PCB and low-cost FR4 PCB manufacturing.

According to ZBPCB’s PCB equipment and PCB production conditions, PCB process foundation, management level, PCB production process level, customized ZBPCB,
As the basis for ZBPCB purchase order, contract review, engineering design.

For more information on standard PCB process capabilities, please click Download Process Capability Datasheet Download Document. If you have any questions, please contact us.

FR-4 PCB maximum number of layers: 108 layers

Maximum production size: 2000*650mm (size decreases as the number of layers increases), can manufacture standard PCB boards, HDI buried and blind hole PCBs, multi-material mixed pressure PCBs,
High-frequency boards, rigid-flex PCBs.

We use line and solder mask direct imaging (LDI) for more precise line control; high-layer PCB boards and laser perforation direct electroplating blind hole filling for better PCB flatness.
Use character printing for clearer silk screen printing.

Our PCB R&D and manufacturing goals for the next two years

1. Advanced pulse plating to increase the high aspect ratio to more than 48:1

2. Impedance control tolerance reduced to more than ±5%

3. Line width and line spacing reduced to 25/25um

4. Continue to verify high-end HDI PCB, high-speed low-loss PCB, IC substrate and new PCB materials for thinner and more precise applications

5. Deep micro-hole research (above aspect ratio 1:1)

6. Metal core board, conductive paste (Ormet, Tatsuta), copper paste plugging technology research

7. Embedded component PCB process research such as embedded capacitance PCB, embedded resistance PCB, embedded magnetic PCB

Standard PCB Technics Capacity